2、Allegro Cadence PCB設(shè)計(jì)高級(jí)
?培訓(xùn)目標(biāo)：
Cadence培訓(xùn)高級(jí)班將首先讓您了解CB板上出現(xiàn)的信號(hào)反射、串?dāng)_、電源/地平面干擾、時(shí)序匹配以及電磁兼容性等一系列問題產(chǎn)生的機(jī)理，并掌握其解決方法；然后講解并上機(jī)練習(xí)Cadence的高速 PCB設(shè)計(jì)與仿真工具SPECCTRAQuest的使用。使您在硬件設(shè)計(jì)過程中，能夠達(dá)到“設(shè)計(jì)即正確”的目的。
培訓(xùn)大綱：
1 高速PCB設(shè)計(jì)中的理論基礎(chǔ)
? ? 傳輸線理論、信號(hào)完整性（反射、串?dāng)_、過沖、地彈、振鈴等）、電磁兼容性和時(shí)序匹配等等。
2 SPECCTRAQuest設(shè)計(jì)流程
? ? 2.1 Pre-Placement
? ? 2.2 Board Setup Requirements for Extracting and Applying Topologies
? ? 2.3 Database Setup Advisor
? ? ? ? —Cross-Section
? ? ? ? —DC Nets
? ? ? ? —DC Voltages
? ? ? ? —Device Setup . ??—SI Models
? ? ? ? —SI Audit
3 拓?fù)浣Y(jié)構(gòu)的抽取與仿真 Extracting and Simulating Topologies?
? ? 3.1 Pre-Route Extraction Setup—Default Model Selection.
? ? 3.2 Pre-Route Extraction Setup—Unrouted Interconnect?
? ? 3.3 Pre-Route Template Extraction
? ? 3.4 SQ Signal Explorer Expert
? ? 3.5 Analysis Preferences
? ? 3.6 SigWave
? ? 3.7 Delay Measurements
4 確定和施加約束 Determining and Adding ConstraintsSolution?
? ? 4.1 Solution SpaceAnalysis: Step 1 to 6?
? ? 4.2 Parametric Sweeps.
? ? 4.3 Constraints
? ? 4.4 Usage of Constraints Defined in Topology Template
5 模板應(yīng)用和基于約束的布局
? ? Template Applications and Constraint-Driven Placement
? ? 5.1 Creating a Topology?
? ? 5.2 Wiring the Topology
? ? 5.3 TLines and Trace Models?
? ? 5.4 Coupled Traces?
? ? 5.5 RLGC Matrix of Coupled Trace Models
? ? 5.6 Crosstalk Simulation in SQ Signal Explorer Expert?
? ? 5.7 Simulating with Coupled-Trace Models
? ? 5.8 Sweep Simulation Results with Coupled-Trace Models
? ? 5.9 Extracting a Topology Using the Constraint Manager?
? ? 5.10 Electrical Constraint Set
? ? 5.11 Applying Electrical CSet
? ? 5.12 Worksheet Analysis
? ? 5.13 Spacing and Physical Rule Sets
? ? 5.14 Electrical Rule Set
6 基于約束的布線 Constraint-Driven Routing?
? ? 6.1 Manual Routing
? ? 6.2 Routing with the SPECCTRA Smart Route
? ? 6.3 Driving Constraints in Routing
7 布線后的DRC檢查和分析 Post-Route DRC and Analysis
? ? 7.1 Post-Route Analysis
? ? 7.2 SigNoise
? ? 7.3 Reflection Simulation
? ? 7.4 Reflection Waveform Analysis
? ? 7.5 Comprehensive Simulation
? ? 7.6 Crosstalk Simulation
? ? 7.7 Crosstalk Analysis?
? ? 7.8 Simultaneous Switching Noise Simulation
? ? 7.9 SSN Waveform Analysis
? ? 7.10 System-Level Analysis?
? ? 7.11 A Complete Design Link
? ? 7.12 Initialize Design Link
8 差分信號(hào)設(shè)計(jì) Differential Pair Design Exploration
? ? 8.1 Types of Differential Pairs in SPECCTRAQuest
? ? 8.2 Create Differential Pair Using SPECCTRAQuest
? ? 8.3 Create Differential Pair Using Constraint Manager?
? ? 8.4 Assigning Differential Pair Signal Models
? ? 8.5 Preference to Extract Unrouted Differential Pair Topology
? ? 8.6 Extracting Unrouted Differential Pair Topology
? ? 8.7 Custom Stimulus to Analyze Differential Pair Topology?
? ? 8.8 Differential Pair Topology Analysis
? ? 8.9 Coupled Trace Model and Differential Pair Topology
? ? 8.10 Layout Cross-section Editor
? ? 8.11 Differential Pair Constraints
? ? 8.12 Differential Pair Constraints in the Constraint Manager?
? ? 8.13 Differential Pair Analysis in the Constraint Manager?
? ? 8.14 Post Route Extraction
9.SI 仿真
?????9.1 時(shí)序仿真
?????9.2 差分仿真
?????9.3 反射仿真
?????9.4 Crosstalk串?dāng)_仿真
?????9.5 EMI?
10 PI 電源完整性仿真
????10.1 電源完整性工具
????10.2 電容器和單節(jié)點(diǎn)仿真流程
11.多板仿真
???11.1 DesinLik模型創(chuàng)建
???11.2 多板仿真?
12.后仿真
???12.1 反射仿真
???12.2 綜合仿真
???12.3 SSN同步開關(guān)噪聲仿真
???12.4 串?dāng)_仿真?
13.EMI/EMC仿真
???13.1 仿真要點(diǎn)
???13.2 仿真流程
?
14. IR-DROP電源壓降仿真
電磁兼容設(shè)計(jì)的關(guān)系 |
合作伙伴與授權(quán)機(jī)構(gòu)
總部李老師
